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SSOT-24 packaging information reference pattern layout dimension unit: mm packaging information / reference pattern layout dimensions 0.75 0.5 1.85 1.3 0.6
SSOT-24 ` /reel ?`?? /taping specifications ?`?? / ta p in g s p ecifications unit: mm 3,000pcs/reel direction of feed r type :[device orientation : right] standard feed -0 -3 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 +0 180 +1 60
SSOT-24 power dissipation power dissipation data for the SSOT-24 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as the reference data taken in the following condition. condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tie d to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 2. power dissipation vs. ambient temperature (85 ) board mount (tjmax=125 ) 3. power dissipation vs. ambient temperature (105 ) board mount (tjmax=125 ) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 500 200.00 85 200 ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 500 200.00 85 100 evaluation board ( unit: mm ) pd vs. ta power dissipation pd (mw) ambient temperature ta( ) pd vs. ta power dissi p ation pd ( mw ) ambient temperature ta( )
rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammabilit y ratin g resin epoxy resin ul94v-0 `??` ~? lead frame copper alloy ?I U?`?? lead plating lead(pb) free solder plating ? ? die attach epoxy ???? au bonding wire ?? si silicon chip ?? `` marking laser marking SSOT-24 SSOT-24 perspective ver.09

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